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mPGA604 Socket 9
Mechanical Design Guide
2 Assembled Component and
Package Description
The mPGA604 socket dimensions and characteristics must be compatible with that of the processor
package and related assembly components. Processors using flip-chip pin grid array (FC- mPGA4)
package technology are targeted to be used with the mPGA604 socket.
The assembled component may consist of a cooling solution (heatsink, fan, and retention
mechanism), and processor package. The processor Thermal/Mechanical Design Guidelines
document provides information for designing components compliant with the Intel reference design.
Relevant processor FC-mPGA4 package and pin-out information is given in the processor
Electrical, Mechanical and Thermal Specifications document.
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