2SK3069
Rev.11.00 Sep 07, 2005 page 4 of 7
Case Temperature T
C
(°C)
Static Drain to Source on State
Resistance vs. Temperature
Static Drain to Source on State Resistance
R
DS (on)
(mΩ)
Forward Transfer Admittance
vs. Drain Current
Drain Current I
D
(A)
Forward Transfer Admittance y
fs
(S)
Body to Drain Diode Reverse
Recovery Time
Reverse Drain Current I
DR
(A)
Reverse Recovery Time t
rr
(ns)
Typical Capacitance
vs. Drain to Source Voltage
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
Dynamic Input Characteristics
Gate Charge Qg (nc)
Drain to Source Voltage V
DS
(V)
Gate to Source Voltage V
GS
(V)
Switching Characteristics
Switching Time t (ns)
Drain Current I
D
(A)
20
16
12
8
4
–50 0 50 100 150 200
0
V
GS
= 10 V
4 V
Pulse Test
10, 20, 50 A
I
D
= 50 A
10 A
20 A
0.1 0.3 1 3 10 30 100
500
100
200
20
50
10
2
5
1
0.5
Tc = –25°C
75°C
25°C
V
DS
= 10 V
Pulse Test
0.1 0.3 1 3 10 30 100
01020304050
1000
10000
3000
100
80
60
40
20
0
20
16
12
8
4
80 160 240 320 400
0
1000
100
200
20
10
0.1 0.2
2
10 100
1000
500
100
200
20
50
10
di / dt = 50 A / µs
V
GS
= 0, Ta = 25°C
300
20
1
100
V
GS
= 0
f = 1 MHz
Ciss
Coss
Crss
I
D
= 75 A
V
GS
V
DS
V
DD
= 50 V
25 V
10 V
V
DD
= 50 V
25 V
10 V
0.5
5
500
50
50
V
GS
= 10 V, V
DD
= 30 V
PW = 5 µs, duty < 1 %
t
r
t
d(on)
t
d(off)
t
f
30000