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6
(4) Notes on soldering the IC socket
a) The IC socket is larger than the actual IC package; therefore, refer to figure 7 for the
installation of other components.
b) Do not install components that occupy large volume close to the IC socket. Such
components will prevent the convective flow of heat during reflow.
c) Since the IC socket has a greater volume than the IC package, it is recommended that the
temperature profile under the conditions used in installation be measured by attaching a
temperature sensor to the back side of the IC socket.
d) Under the reflow conditions for soldering the IC socket, specify the actual heating to
more than 210°C for 30 to 60 seconds.
Recommended Reflow Conditions
Surface temperature of IC-socket connector
Preheating: 150 to 180°C for 180 seconds
Actual heating: To more than 210°C, for 30 to 60
seconds