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2-2
REFERENCE INFORMATION
Samsung Electronics
Service Manual
2.2 Acronyms and Abbreviations
The table in the below explains abbreviations used in this service manual.
The contents of this service manual are declared with abbreviations in many parts. Please refer to the
table.
AC Alternating Current
ASIC Application Specific Integrated Circuit
ASSY assembly
BIOS Basic Input Output System
CMOS Complementary Metal Oxide
Semiconductor
CN connector
CON connector
CPU Central Processing Unit
dB decibel
dbA decibelampere
dBM decibel milliwatt
DC direct current
DCU Diagnostic Control Unit
DPI Dot Per Inch
DRAM Dynamic Random Access Memory
DVM Digital Voltmeter
ECP Enhanced Capability Port
EEPROM Electronically Erasable Programmable
Read Only Memory
EMI Electro Magnetic Interference
EP electrophotographic
EPP Enhanced Parallel Port
F/W firmware
GDI graphics device interface
GND ground
HBP Host Based Printing
HDD Hard Disk Drive
HV high voltage
HVPS High Voltage Power Supply
I/F interface
I/O Input and Output
IC integrated circuit
IDE Intelligent Drive electronics or Imbedded
Drive Electronics
IEEE Institute of Electrical and Electronics
Engineers. Inc
IPA Isopropy Alcohol
IPM Images Per Minute
LAN local area network
lb pound(s)
LBP Laser Beam Printer
LCD Liquid Crystal Display
LED Light Emitting Diode
LSU Laser Scanning Unit
MB megabyte
MHz megahertz
NVRAM nonvolatile random access memory
OPC Organic Photo Conductor
PBA Printed Board Assembly
PCL Printer Command Language , Printer
Control Language
PDL Page Discription Language
PPM Page Per Minute
PTL Pre-Transfer Lamp
Q-PID Quick Printer Initiating Device
Q ty quantity
RAM Random Access Memory
ROM Read Only Memory
SCF Second Cassette Feeder
SMPS Switching Mode Power Supply
SPGP Samsung Printer Graphic Processor
SPL Samsung Printer Language
Spool Simultaneous Peripheral Operation Online
SW switch
sync synchronous or synchronization
USB Universal Serial Bus