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5PhysicalDescription
5.1PCBLayout
K001
PhysicalDescription
ThischapterdescribesthephysicalcharacteristicsandPCBlayoutoftheEVM.
TheEVMisconstructedona6-layer,0.062-inchthickPCBusingFR-4material.Theindividuallayersare
showninFigure4throughFigure9.Thelayoutfeaturessplitanaloganddigitalgroundplanes;however,
similarperformancecanbehadwithcarefullayoutusingasinglegroundplane.Userscanconnectthe
analoganddigitalgroundplanesunderneaththeEVMbysolderingthetwoexposedtinnedstripstogether.
Figure4.TopLayer
14SLWU028B–January2006–RevisedNovember2006
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