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EVM Configuration and Description
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3.3 Board Stack-Up
Table 3 shows the board stack-up.
Table 3. Board Stack-Up
Subclass Thickness Dielectric Loss Width Impedance Coupling Spacing Diff Z
o
Type Shield
Name (mils) Constant Tangent (mils) (Ω) Type (mils) (Ω)
1 SURFACE
2 TOP CONDUCTOR 2.4 1 0 7.5 47.72 EDGE 7.5 85.004
3 DIELECTRIC 4 4.1 0.035
4 GND PLANE 1.2 1 0 YES
5 DIELECTRIC 48 4.1 0.035
6 VCC PLANE 1.2 1 0 YES
7 DIELECTRIC 4 4.1 0.035 7.5 47.72 EDGE 7.5 85.004
8 BOTTOM CONDUCTOR 2.4 1 0
9 SURFACE
6
TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009
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