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CY7C1041DV33
Document #: 38-05473 Rev. *E Page 4 of 13
Capacitance
[6]
Parameter Description Test Conditions Max Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz, V
CC
= 3.3V 8 pF
C
OUT
IO Capacitance 8 pF
Thermal Resistance
[6]
Parameter Description Test Conditions
FBGA
Package
SOJ
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance (Junction
to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
four layer printed circuit board
27.89 57.91 50.66 °C/W
Θ
JC
Thermal Resistance (Junction
to Case)
14.74 36.73 17.17 °C/W
AC Test Loads and Waveforms
The AC test loads and waveform diagram follows.
[7]
90%
10%
3.0V
GND
90%
10%
ALL INPUT PULSES
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
Rise Time: 1 V/ns
Fall Time: 1 V/ns
30 pF*
OUTPUT
Z = 50Ω
50Ω
1.5V
(b)
(a)
3.3V
OUTPUT
5 pF
(c)
R 317Ω
R2
351Ω
High-Z Characteristics
10 ns device
Notes
6. Tested initially and after any design or process changes that may affect these parameters.
7. AC characteristics (except High-Z) are tested using the load conditions shown in AC Test Loads and Waveforms (a). High-Z characteristics are tested for all speeds
using the test load shown in (c).
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