20 Chapter 1
Wireless Module
LAN Module
Bluetooth
Hard Disk Drive Interface
Item Specification
Manufacturer • Atheros HB93, Broadcomm 43225, Atheros HB97,
Atheros HB95BG
Specifications • IEEE 802.11b/g and Draft-N1 compliant
• Advanced security via 802.11i
• Industry-leading power consumption
• Includes Wi-Fi PAN – Intel® My WiFi Technology
• Easy to use Intel® PROSet v12.5 WLAN Software
• Advanced IT capabilities with Intel® PROSet
Software4
• Support for Cisco Compatible Extensions* v4
• Connect with Intel® Centrino® program eligible
Item Specification
Chipset • Atheros AR8151 GbE LAN Controller with Integrated
Transceiver
Specifications • Integrated PHY for 10/100/1000 Mbps
• Supports automatic MDI/MDIX functions
• PCI Express base 1.1 compliant
• Wake on LAN support
• 256 byte memory (using eFuse) embedded on chip
• Supports up to 25% over-clocking without requiring
BIOS support
• Supports Energy Star 5.0
• Small footprint 40-pin QFN (5 x 5 mm) package
with dramatically improved
thermal and electrical
characteristics over LQFP packaging
Item Specification
Chipset
T60H928.33 miniUSB module
Data throughput
Protocol 2.1
Interface USB 2.0
Connector type 8 pin narrow pitch connector
Item Specification
Capacity (MB)
160
Vendor &
Model Name
Seagate HGST Toshiba WD Samsung
Bytes per
sector
512
Data heads 2 1
Drive Format
Disks 1 1