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Chapter 1 23
Thermal Design
Item Description
Thermal Design T Thermal solutin should cover Intel (R) 2006 FMB (65W)
requirement
T 2 4-pin smart fan for system
T 1 2-pin fan for north bridge
T Provision for optional secondary fan
T Adequate venting in the front of chassis
T Adequate venting in the rear of chassis
Memory Address Map
Address Size Function
0000000 - 009FFFF 640 KB System Memory Onboard DRAM
00A0000-00BFFFF 128 KB Video RAM Reserved for Graphics Display
Buffer
Non-Cacheable
00C0000-00CFFFF 32 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00D0000-00D3FFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00D4000-00D7FFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00D8000-00DBFFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00DC000-00DFFFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00E0000-00E7FFF 32 KB for SCSI BIOS Reserved for SCSI BIOS
00E8000-00EFFFF 32 KB Reserved Onboard
00F0000-00FFFFF 64 KB BIOS System ROM BIOS (ROM)
System RAM BIOS (DRAM)
0100000-0F9FFFF System Memory Onboard DRAM
0FA0000-0FFFFFF 384 KB I/O Card Memory Reserved for Memory Map
I/O Card
Non-Cacheable
1000000-FFFFFFF System Memory Onboard DRAM
PCI INTx# and IDSEL Assignment Map
PCI INTx # PCI Devices Device IDSEL: ADxx
INTA# ADIMM-slot N
INTB# PCI-Slot1 AD16
INTC# PCI-Slot2 AD17