CY7C1034DV33
Document Number: 001-08351 Rev. *C Page 3 of 9
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55°C to +125°C
Supply Voltage on V
CC
Relative to GND
[2]
....–0.5V to +4.6V
DC Voltage Applied to Outputs
in High Z State
[2]
...................................–0.5V to V
CC
+ 0.5V
DC Input Voltage
[2]
...............................–0.5V to V
CC
+ 0.5V
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage............................................>2001V
(MIL-STD-883, Method 3015)
Latch up Current......................................................>200 mA
Operating Range
Range
Ambient
Temperature
V
CC
Industrial –40°C to +85°C3.3V ± 0.3V
DC Electrical Characteristics
Over the operating range
Parameter Description Test Conditions
[3]
–10
Unit
Min Max
V
OH
Output HIGH Voltage V
CC
= Min, I
OH
= –4.0 mA 2.4 V
V
OL
Output LOW Voltage V
CC
= Min, I
OL
= 8.0 mA 0.4 V
V
IH
Input HIGH Voltage 2.0 V
CC
+ 0.3 V
V
IL
[2]
Input LOW Voltage –0.3 0.8 V
I
IX
Input Leakage Current GND < V
I
< V
CC
–1 +1 μA
I
OZ
Output Leakage Current GND < V
OUT
< V
CC
, output disabled –1 +1 μA
I
CC
V
CC
Operating Supply
Current
V
CC
= Max, f = f
MAX
= 1/t
RC
,
I
OUT
= 0 mA CMOS levels
175 mA
I
SB1
Automatic CE Power Down
Current — TTL Inputs
Max V
CC
, CE
1
, CE
3
> V
IH,
CE
2
< V
IL
,
V
IN
> V
IH
or V
IN
< V
IL
, f = f
MAX
30 mA
I
SB2
Automatic CE Power Down
Current — CMOS Inputs
Max V
CC
, CE
1
, CE
3
> V
CC
– 0.3V, CE
2
< 0.3V,
V
IN
> V
CC
– 0.3V, or V
IN
< 0.3V, f = 0
25 mA
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions Max Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz, V
CC
= 3.3V 8 pF
C
OUT
IO Capacitance 10 pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions
119-Ball
PBGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still air, soldered on a 3 × 4.5 inch,
four layer printed circuit board
20.31 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
8.35 °C/W
Notes
2. V
IL
(min) = –2.0V and V
IH
(max) = V
CC
+ 2V for pulse durations of less than 20 ns.
3. CE
refers to a combination of CE
1
, CE
2
, and CE
3
. CE is active LOW when CE
1
is LOW, CE
2
is HIGH, and CE
3
is LOW. CE is HIGH when CE
1
is HIGH or CE
2
is LOW
or CE
3
is HIGH.
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