Filter
Top Products
CY7C1480V25
CY7C1482V25
CY7C1486V25
Document #: 38-05282 Rev. *H Page 20 of 32
Capacitance
[14]
Parameter Description Test Conditions
100 TQFP
Package
165 FBGA
Package
209 FBGA
Package
Unit
C
ADDRESS
Address Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 2.5V
V
DDQ
= 2.5V
666pF
C
DATA
Data Input Capacitance 5 5 5 pF
C
CTRL
Control Input Capacitance 8 8 8 pF
C
CLK
Clock Input Capacitance 6 6 6 pF
C
I/O
Input/Output Capacitance 5 5 5 pF
Thermal Resistance
[14]
Parameter Description Test Conditions
100 TQFP
Max.
165 FBGA
Max.
209 FBGA
Max.
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
24.63 16.3 15.2 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
2.28 2.1 1.7 °C/W
Note
14.Tested initially and after any design or process change that may affect these parameters.
AC Test Loads and Waveforms
OUTPUT
R = 1667Ω
R = 1583Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
L
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
OUTPUT
R = 14KΩ
R = 14KΩ
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
L
= 0.9V
1.8V
ALL INPUT PULSES
V
DDQ
-0.2
0.2
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
2.5V I/O Test Load
1.8V I/O Test Load
[+] Feedback