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CY7C65113C
Document #: 38-08002 Rev. *D Page 48 of 49
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Purchase of I
2
C components from Cypress, or one of its sublicensed Associated Companies, conveys a license under the Philips
I
2
C Patent Rights to use these components in an I
2
C system, provided that the system conforms to the I
2
C Standard Specification
as defined by Philips. All product and company names mentioned in this document are the trademarks of their respective holders.
24.0 Ordering Information
Ordering Code PROM Size Package Type Operating Range
CY7C65113C-SXC 8 KB 28-pin SOIC Commercial
CY7C65113C-SXCT 8 KB 28-pin SOIC-Tape Reel Commercial
25.0 Package Diagram
PIN1ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATINGPLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
114
15 28
*
*
*
PART#
S28.3 STANDARDPKG.
SZ28.3LEADFREEPKG.
MIN.
MAX.
NOTE:
1.JEDEC STDREFMO-119
2.BODY LENGTHDIMENSIONDOESNOT INCLUDEMOLDPROTRUSION/END FLASH,BUT
MOLDPROTRUSION/END FLASHSHALLNOTEXCEED 0.010in(0.254 mm)PER SIDE
3.DIMENSIONS ININCHES
4.PACKAGE WEIGHT0.85gms
DOESINCLUDE MOLDMISMATCHANDARE MEASUREDATTHE MOLDPARTINGLINE.
51-85026-*D
28-Lead (300-Mil) Molded SOIC
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