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Document Number: 001-44369 Rev. *B Page 35 of 37
Figure 20. 28-Pin (210-Mil) SSOP
Thermal Impedances Capacitance on Crystal Pins
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
51-85079 *C
Table 38. Thermal Impedances by Package
Package
Typical θ
JA
[22]
32 QFN 19.4°C/W
28 SSOP 95°C/W
Table 39. Typical Package Capacitance on Crystal Pins
Package Package Capacitance
32 QFN 2.0 pF
28 SSOP 2.8 pF
Table 40. Solder Reflow Peak Temperature
Package Minimum Peak Temperature
[23]
Maximum Peak Temperature
32 QFN 240°C 260°C
28 SSOP 240°C 260°C
Notes
22. T
J
= T
A
+ POWER x θ
JA
.
23.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C with Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
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