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CY8C24123
CY8C24223, CY8C24423
Document Number: 38-12011 Rev. *G Page 41 of 43
Figure 27. 32-Pin (5x5 mm) MLF
Thermal Impedances Capacitance on Crystal Pins
51-85188 *B
Table 36. Thermal Impedances per Package
Package Typical θ
JA
*
8 PDIP 123
o
C/W
8 SOIC 185
o
C/W
20 PDIP 109
o
C/W
20 SSOP 117
o
C/W
20 SOIC 81
o
C/W
28 PDIP 69
o
C/W
28 SSOP 101
o
C/W
28 SOIC 74
o
C/W
32 MLF 22
o
C/W
* T
J
= T
A
+ POWER x θ
JA
Table 37. Typical Package Capacitance on Crystal Pins
Package Package Capacitance
8 PDIP 2.8 pF
8 SOIC 2.0 pF
20 PDIP 3.0 pF
20 SSOP 2.6 pF
20 SOIC 2.5 pF
28 PDIP 3.5 pF
28 SSOP 2.8 pF
28 SOIC 2.7 pF
32 MLF 2.0 pF
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