HP (Hewlett-Packard) AS322USABA Laptop User Manual


 
3. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and system board each time the heat sink is removed. Thermal paste and pads are located on
the heat sink (1) and on system board components (2). Replacement thermal material is
included with all heat sink and system board spare part kits. Replacement thermal material is
included with all heat sink and system board spare part kits.
Reverse this procedure to install the heat sink.
Component replacement procedures 95