HP (Hewlett-Packard) BL870C I2 Server User Manual


 
3. Pull the CPU baffle straight up and out.
To replace the component, reverse the removal procedure.
CPU and heatsink module
The BL860c i2 Server Blade contains a processor subsystem accommodating one or two Intel
Itanium processor modules.
Each processor module consists of the following:
CPU chip, including CPU cores, QPI links for CPU-CPU and CPU-IO Hub chip connections,
and SMI links for CPU-Memory interface chip connections
CPU power conversion module
Heatsink, with mechanical attachment / assembly features
WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent possible server malfunction, do not mix CPUs of different speeds or cache
sizes.
CAUTION: Removing a CPU will cause the DIMM loading rules to change. See “DIMMs”
(page 49) and use the loading rules for two CPUs. If you do not perform these procedures, then
any memory associated with the removed CPU will not be seen by the system.
CAUTION: To prevent thermal instability and damage to the server, do not separate the CPU
module from the heatsink.
1. Power off the server, and remove it from the enclosure (“Preparing the server blade for
servicing” (page 110)).
118 Removing and replacing components