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4.
Remove the fan/heat sink assembly (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the fan/heat sink assembly is removed. Replacement
thermal material is included with the fan/heat sink assembly, processor, and system board spare
part kits.
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that
services it
●
A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
Component replacement procedures
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