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d.
WWAN module (see
WWAN module on page 92)
e. WLAN module (see
WLAN module on page 94)
f.
Fan (see
Fan on page 100)
g. Keyboard (see
Keyboard on page 101)
h. Base enclosure (see
Base enclosure on page 107)
i. System board (see
System board on page 121)
Remove the heat sink:
1. Turn the system board upside down, with the front toward you.
NOTE: Step 2 applies to computer models equipped with a graphics subsystem with discrete
memory. See step 3 for heat sink removal information for computer models equipped with a
graphics subsystem with UMA memory.
2. Following the 1, 2, 3, 4, 5, 6, 7 sequence stamped into the heat sink, loosen the seven captive
Philllips screws (1) and (2) that secure the heat sink to the system board, and then remove
the heat sink (3).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
3. Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips
screws (1) that secure the heat sink to the system board, and then remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
128 Chapter 4 Removal and replacement procedures