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Reference Thermal Solution
Intel
®
6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 11
4.0 Reference Thermal Solution
Based on a component local operating environment of natural convection (zero LFM of airflow)
with a maximum local-ambient temperature of 55° C, the Intel 6300ESB ICH component does not
require an attached heatsink to meet thermal specifications. For systems where the local-ambient
temperature is severe (greater than 55° C, natural convection), a component level thermal solution
or system thermal solution improvement may be required. Attaching a heatsink to the package case
and/or improving airflow at the component may be potential solutions.
4.1 Reliability Requirements
If an attached heatsink is implemented due to a severe component local operating environment, the
reliability requirements in Table 4 are recommended. Each motherboard, heatsink, and attach
combination may vary the mechanical loading of the component. It is recommended that the user
carefully evaluate the reliability of the completed assembly prior to use in high volume.
Table 4. Reliability Requirements
Test
1
Requirement Pass/Fail Criteria
2
Mechanical Shock 50g, board level, 11 msec, 3 shocks/axis Visual check and electrical functional test
Random Vibration
7.3g, board level, 45 min/axis, 50 Hz to
2000 Hz
Visual check and electrical functional test
Temperature Life
85° C, 2000 hours total, checkpoints at
168, 500, 1000, and 2000 hours
Visual check
Thermal Cycling
-5° C to +70° C, 500 cycles, ° C/min rise
and fall
Visual check
Humidity 85% relative humidity, 55° C, 1000 hours Visual check
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.