Filter
Top Products
Thermal Specifications
Intel
®
6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 9
3.0 Thermal Specifications
3.1 Case Temperature and Thermal Design Power
To ensure proper operation and reliability of the Intel 6300ESB ICH component, the case and
junction temperatures must be at or below the values specified in Table 3. System and/or
component level thermal solutions are required to maintain the case temperature below the
maximum temperature specification while dissipating the thermal design power (TDP) listed in
Table 3.
3.2 Case Temperature Metrology
The component case temperature should be measured by attaching a thermocouple to the geometric
center of the package case top. Refer to Appendix A, “Mechanical Drawings” for package
dimensions.
Table 3. Intel
®
6300ESB I/O Controller Hub Thermal Specifications
Parameter Maximum Notes
T
case-nhs
105 °C 1
T
j-max
115 °C 2
TDP 3.9 W
NOTES:
1. T
case-nhs
is defined as the maximum package case temperature without a
thermal solution attached.
2. T
j-max
is defined as the maximum component temperature specification
measured at the hottest point in the processor die.