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Introduction
Intel
®
6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 5
1.0 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Heat may be dissipated
using improved system cooling and/or attaching passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within functional limits. The functional temperature limit is the range within
which the electrical circuits may be expected to meet specified performance requirements.
Operation outside the functional limit may degrade system performance, cause logic errors, or
cause component and/or system damage. Temperatures exceeding the maximum operating limits
may result in irreversible changes in the operating characteristics of the component. The goal of
this document is to provide an understanding of the operating limits of the Intel
®
6300ESB I/O
Controller Hub (ICH).
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system
thermal solutions. The size of the fan or heatsink may be varied to balance size and space
constraints with acoustic noise.
This document presents the conditions and requirements to properly design a cooling solution for
systems using the Intel 6300ESB ICH. Properly designed solutions should provide adequate
cooling to maintain the Intel 6300ESB ICH case temperatures at or below thermal specifications.
This is accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the case
temperatures of the Intel 6300ESB ICH at or below those recommended in this document, a system
designer may ensure the proper functionality, performance, and reliability of these components.
1.1 Definition of Terms
Table 1. Definition of Terms
Term Definition
BGA
Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical interface is
an array of solder balls attached to the substrate opposite the die and molding compound.
T
case-nhs
The maximum package case temperature without any package thermal solution. This
temperature is measured at the geometric center of the top of the package case.
T
j-max
The maximum component temperature specification measured at the hottest point in the
processor die.
TDP
Thermal Design Power. Thermal solutions should be designed to dissipate this target power
level.
LFM
Linear Feet Per Minute. A measure of airflow emitted from a forced convection device, such
as an axial fan or blower.