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16.06.04
Computer-On-Modules / ETXexpress
Features ETXexpress-PM
CPU
Intel
®
Pentium
®
M, Intel
®
Celeron
®
M
CPU Clock
600 MHz up to 2.0 GHz
Cache
512 kByte up to 2 MByte L2
Chipset
Intel
®
915GM, ICH6-M
Bus Speed
400/533 MHz FSB
DRAM
up to 2 GByte (DDR2-RAM)
DRAM socket
DDR2-SODIMM socket
SM Bus Support
Flash Disk
-
Hard Disk
4x Serial ATA, 1x Parallel ATA
USB
USB 2.0, 8 ports
USB Boot/Legacy Support
/
Ethernet
10/100Base-Tx
will be upgraded to Gigabit Ethernet
Ethernet Controller
Intel
®
82562 (integrated)
Audio Controller
Intel
®
High Defi nition Audio - onboard
Graphics Controller
Intel
®
Graphics Media Accelerator (GMA) 900
with a powerful 333 MHz core and new DirectX
9 hardware acceleration or expand via
16x PCIexpress card
Graphics Memory
Dynamic Video Memory Technology (DVMT) 3.0
supports up to 224 MByte VRAM UMA
Flat Panel Interface
DUAL DVO (multiplexed with PCI-Express
Graphics port), CRT, DVI A / I, JILI-LVDS
Power Management
ACPI 2.0 + APM 1.2
Power Consumption (typ.)
30W @ 12 V
Dimensions H x W
95 x 125 mm
PCI
4 PCI Express x1 lanes, PCI 2.3, 32 bit / 66 MHz
RoHS compliant
ETXexpress-PM
ET
express
www.etx-express.com
TM
new
14
15
ETXexpress
™
– Perform beyond the limits
The ETXexpress
™
Solution
ETXexpress
™
is the Module concept for the new open
Standard COM Express (by PICMG).
The module offers complete, multimedia-capable compu-
ting cores for high-level applications and high perfor-
mance for your next generation product. The modules
are highly integrated off-the-shelf building blocks based
on PCI Express Bus architecture that plug into custom-
made, application-specific carrier boards.
PCI-Express
™
is the primary data path for upcoming x86
based systems. Non PCI-Express components such as PCI
plug-in cards can still be supported with the PCI 2.1
32 Bit Interface, as ETXexpress
™
COMs will continue to
support the PCI bus for legacy applications.
ETXexpress
™
- the standard of the inventor.
Ultra-high performance with the latest interface
technologies
PCI-Express - the elemental datapath
Gigabit Ethernet - for high connectivity
SerialATA - for highspeed mass storage
USB 2.0 - for fast peripherals
Dual Channel DDR2 - for maximum
memory bandwidth
ExpressCard
™
- for hot-pluggable I/O cards
Dual Channel LVDS - for high resolution
SDVO - for maximum display flexibility
The Thermal Concept
ETXexpress
™
Heatspreader
provides:
Identical mechanical size
- all ETXexpress
™
modules fit in
the same system.
The only surface that needs
cooling is the top of the
heatspreader.
ETXexpress
™
Starter-KIT
Complete Starterkit for im-
mediate evaluation purposes.
Includes all required hard- and
software components for a
quick start.
Choose your Module
for the starterkit.
ETXexpress