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4 LGA 771 Socket Mechanical Design Guide
Figures
3-1 Cross-sectional view of Package / Socket stackup height
1
.......................................15
3-2 Definition of R ...................................................................................................17
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology...........................21
A-1 LGA Socket Assembly Drawing (Sheet 1 of 4) ........................................................26
A-2 LGA Socket Assembly Drawing (Sheet 2 of 4) ........................................................27
A-3 LGA Socket Assembly Drawing (Sheet 3 of 4) ........................................................28
A-4 LGA Socket Assembly Drawing (Sheet 4 of 4) ........................................................29
A-5 LGA771 Socket Motherboard Footprint (Sheet 1 of 7) .............................................30
A-6 LGA771 Socket Motherboard Footprint (Sheet 2 of 7) .............................................31
A-7 LGA771 Socket Motherboard Footprint (Sheet 3 of 7) .............................................32
A-8 LGA771 Socket Motherboard Footprint (Sheet 4 of 7...............................................33
A-9 LGA771 Socket Motherboard Footprint (Sheet 5 of 7) .............................................34
A-10 LGA771 Socket Motherboard Footprint (Sheet 6 of 7) .............................................35
A-11 LGA 771 Socket Motherboard Footprint (Sheet 7 of 7) ............................................36
A-12 LGA 771 Socket Footprint (Sheet 1 of 2) ..............................................................37
A-13 LGA 771 Socket Footprint (Sheet 2 of 2) ..............................................................38
Tables
3-1 Intel® Xeon® 5000 Sequence Package and Socket Stackup Height ..........................15
3-2 Socket Loading Specifications..............................................................................16
4-1 LGA771 Socket Electrical Requirements ................................................................19
5-1 Use Conditions Environment................................................................................22