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Introduction
8 LGA 771 Socket Mechanical Design Guide
1.2 Terminology
1.3 Reference Documents
Note: Contact your Intel representative for the latest revisions of these documents.
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Term Description
LGA771 Socket Processor in the 771-land package mates with the system board through a surface
mount, 771-pin, LGA (land grid array) socket.
LGA771-Land
LGA771 Package
Processors in the 771-Land package are available in a Flip-Chip Land Grid Array
package technology, consisting of a processor core mounted on a substrate with an
integrated heat spreader (IHS). This packaging technology employs a 1.09 mm x
1.17 mm pitch for the substrate lands. Refer to the processor datasheet for
additional information.
IHS (Integrated Heat
Spreader)
A component of the processor package used to enhance the thermal performance of
the package. Component thermal solutions interface with the processor at the IHS
surface.
Lead-free / Pb-free Lead has not been intentionally added, but lead may still exist as an impurity below
1000 ppm.
RoHS compliant Lead and other materials banned in RoHS Directive are either (1) below all applicable
substance thresholds as proposed by the EU or (2) an approved/pending exemption
applies. (Note: RoHS implementing details are not fully defined and may change).
Document Intel Order Number
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 313079
Dual-Core Intel® Xeon® Processor 5100 Series Datasheet 313355
Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guide 313062
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 313357
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet 315569
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guide 315794