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LGA 771 Socket Mechanical Design Guide 9
Assembled Component and Package Description
2 Assembled Component and
Package Description
The LGA771 Socket dimensions and characteristics must be compatible with that of the
processor package and related assembly components. Processors using Flip-Chip Land
Grid Array package technology are targeted to be used with the LGA771 socket.
The assembled component may consist of a cooling solution (heatsink, fan, clips, and
retention mechanism), and processor package. The processor Thermal/Mechanical
Design Guidelines (TMDG) provides information for designing components compliant
with the Intel reference design.
Relevant processor 771-Land LGA package and pin-out information is given in the
processor datasheet.
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