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Philips Semiconductors Product specification
Logic level TOPFET PIP3107-D
MECHANICAL DATA
Fig.2. SOT428 surface mounting package
1
, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOT428 98-04-07
0 10 20 mm
scale
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)
SOT428
E
b
2
D
1
wAM
bc
b
1
L
1
L
13
2
D
E
1
H
E
L
2
Note
1. Measured from heatsink back to lead.
e
1
e
A
A
2
A
A
1
y
seating plane
mounting
base
A
1
(1)
D
max.
b
D
1
max.
E
max.
H
E
max.
w
y
max.
A
2
b
2
b
1
max.
c
E
1
min.
ee
1
L
1
min.
L
2
L
A
max.
UNIT
DIMENSIONS (mm are the original dimensions)
0.2 0.2
mm
2.38
2.22
0.65
0.45
0.89
0.71
0.89
0.71
1.1
0.9
5.36
5.26
0.4
0.2
6.22
5.98
4.81
4.45
2.285
4.57
10.4
9.6
0.5
0.7
0.5
6.73
6.47
4.0
2.95
2.55
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.1 g
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
October 2001 5 Rev 1.000