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Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic with PECI
SMSC SCH5027E 5 Revision 0.2 (02-11-09)
PRODUCT PREVIEW
Chapter 2 Package Outline
Figure 3 128 Pin QFP Package Outline, 14X20X2.7 Body, 3.2 mm Footprint
Notes:
1. Controlling Unit: millimeter.
2. Controlling Unit: millimeter.
3. Tolerance on the position of the leads is ± 0.04 mm maximum.
4. Package body dimensions D1 and E1 do not include the mold protrusion.
5. Maximum mold protrusion is 0.25 mm.
6. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
7. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 1 128 Pin QFP Package Parameters
MIN NOMINAL MAX REMARKS
A ~ ~ 3.4 Overall Package Height
A1 0.05 ~ 0.5 Standoff
A2 2.55 ~ 3.05 Body Thickness
D 23.00 23.20 23.40 X Span
D1 19.90 20.00 20.10 X body Size
E 17.00 17.20 17.40 Y Span
E1 13.90 14.00 14.10 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.73 0.88 1.03 Lead Foot Length
L1 ~ 1.60 ~ Lead Length
e 0.50 Basic Lead Pitch
q0
o
~7
o
Lead Foot Angle
W 0.10 ~ 0.30 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.30 Lead Foot Radius
ccc ~ ~ 0.08 Coplanarity