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type, application utilization, and ambient temperature. The BladeSystem Power Sizer is available at
the following URL:
http://www.hp.com/go/bladesystem/powercalculator.
Summary
The HP BladeSystem c3000 Enclosure is the next generation of a new modular computing architecture
that consolidates and simplifies infrastructure, reduces operational cost, and delivers IT services more
effectively. The c3000 enclosure is designed for remote sites, small and medium-sized businesses, and
data centers with special power and cooling constraints. Thermal Logic technologies provide the
mechanical design features, built-in intelligence, and control capabilities throughout the BladeSystem
c-Class that enable IT administrators to optimize the power and thermal environments. The
shared,
high-speed NonStop midplane and pooled-power backplane
in the enclosure accommodate new
bandwidths and new technologies. The Onboard Administrator supplies an intelligent infrastructure to
provide essential power and cooling information and to help automate infrastructure management.
The BladeSystem c3000 enclosure provides all the power, cooling, and infrastructure to support
c-Class modular servers, interconnects, and storage components, today and throughout the next
several years.
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