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36 Chapter 1
Hardware Specifications and Configurations
Item T7600 T7400 T7200 T5600 T5500
CPU speed (GHz) 2.33 2.16 2 1.83 1.66
Bus speed (MHz) 667 667 667 667 667
Bus/Core Ratio 1413121110
L2 cache size (MB) 44422
L2 cache speed (GHz) 2.33 2.16 2 1.83 1.66
Package type (pin) 479/478 479/478 479/478 479/478 479/478
Manufacturing technology (nm) 65 65 65 65 65
Thermal design power 34W 34W 34W 34W 34W
Thermal specification (
o
C)
100 100 100 100 100
Core voltage (V) 1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
Item T2700 T2600 T2500 T2400 T2300
CPU speed (GHz) 2.33 2.16 2 1.83 1.66
Bus speed (MHz) 667 667 667 667 667
Bus/Core Ratio 1313121110
L2 cache size (MB) 22222
L2 cache speed (GHz) 2.33 2.16 2 1.83 1.66
Package type (pin) 478 478 479/478 478 478
Manufacturing technology (nm) 65 65 65 65 65
Thermal design power 31W 31W 31W 31W 31W
Thermal specification (
o
C)
100 100 100 100 100
Core voltage (V) 1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
Item Specification
Package Micro-FCBGA 1466-pin
Power 1.05V (core), 1.5V, VCCSM (DDR2 = 1.8V), 2.5V, 3.3V
Feature • Processor host bus support
• Integrated SDRAM controller up to 4GB (2 SODIMM support)
Integrated SDRAM clock buffer to support 2 SODIMM
• External Graphics interface for PCI Express Architecture support
• DMI x 2 and DMI x 4 for connection between GMCH and ICH7M
Item Specification
Package BGA 652-pin
Power 1.05V (core), 1.5V, 3.3V, 5V, CMOS I/O