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32 Chapter 1
NOTE: Above table lists some system memory configurations. You may combine DIMMs with various
capacities to form other combinations. On above table, the configuration of slot 1 and slot 2 could be
reversed.
LAN Interface
Item Specification
Chipset Broadcom 5787
Supports LAN protocol 10/100/1000 Ethernet
Giga LAN
LAN connector type RJ45
LAN connector location Left side
Features Integrated 10/100/1000 BASE-T transceiver
Wake on LAN support compliant with ACPI 2.0
PCI v2.2
Modem Interface
Item Specification
Data modem data baud rate (bps) 56K
Supports modem protocol V.92
Modem connector type RJ11
Modem connector location Right side
Bluetooth Interface
Item Specification
Chipset
Foxconn Bluetooth
®
2.0+EDR
Data throughput 723 bps (full speed data rate)
Protocol Bluetooth 1.1 (Upgradeable to Bluetooth 1.2 when SIG
specification is ratified).
Interface USB 1.1
Connector type USB
Wireless Module 802.11a/b/g/n
Item Specification
Chipset Intel 4965AGN/3945ABG/3945BG
Data throughput 11~54 Mbps
Protocol 802.11a+b+g+Draft-n/802.11a+b+g/802.11b+g
Interface PCI
Hard Disk Drive Interface
Item
Vendor &
Model Name
HGST HTS541680J9SA00
Seagate ST980811AS
Toshiba MK8037GSX
WD WD800BEVS-
22RST0
HGST HTS541612J9SA00
Seagate ST9120822AS
Toshiba MK1237GSX
WD WD1200BEVS-
22RST0
HGST HTS541616J9SA00
Seagate ST9160821AS
Toshiba MK1637GSX
WD WD1600BEVS-
22RST0
Toshiba MK2035GSS
Capacity (MB) 80000 120000 160000 200000
Bytes per
sector
512 512 512 512