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ASUS A8N-SLI Premium 1-3
HyperTransport™ Technology
HyperTransport™ Technology is a high-speed, low latency, point-to-point
link designed to increase the communication speed between integrated
circuits in computers, networking and telecommunicatons equipment up to
48 times faster than other existing technologies.
Dual Channel DDR memory support
Employing the Double Data Rate (DDR) memory technology,
the motherboard supports up to 4GB of system memory using
DDR400/333/266 DIMMs. The ultra-fast 400MHz memory bus delivers the
required bandwidth for the latest 3D graphics, multimedia, and Internet
applications. See page 2-11.
Serial ATA II technology
The motherboard supports the next-generation Serial ATA 3Gb/s
technology through the Serial ATA interfaces and the NVIDIA
®
SLI™ chipset.
The SATA 3Gb/s specification provides twice the bandwidth of the current
Serial ATA products with a host of new features including Native Command
Queuing (NCQ), Power Management (PM) Implementation Algorithm, and
Hot Swap. Additionally, Serial ATA allows thinner, more flexible cables with
lower pin count, and reduced voltage requirement. See pages 2-22 and
2-23.
Dual RAID solution
Onboard RAID controllers provide the motherboard with dual-RAID
functionality that allows you to select the best RAID solution using IDE or
Serial ATA devices.
The NVIDIA
®
nForce4
®
SLI™ allows RAID 0, RAID 1, RAID 0+1 and JBOD
configuration for four SATA connectors or two PATA connectors. See
pages 2-22 and 5-23 for details.
The Sil3114R controller supports four additional SATA connectors and
allows RAID 0, RAID 1, RAID 0+1, and a software patch to support a
bootable RAID 5 configuration. See pages 2-23 and 5-30 for details.
PCI Express™ interface
The motherboard fully supports PCI Express, the latest I/O interconnect
technology that speeds up the PCI bus. PCI Express features point-to-point
serial interconnections between devices and allows higher clockspeeds by
carrying data in packets. This high speed interface is software compatible
with existing PCI specifications. See page 2-17 for details.