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1-18 Chapter 1: Product introduction
M3A78-EM Motherboard Qualied Vendors Lists (QVL)
DDR2-1066 MHz capability
Due to AMD CPU limitation, DDR2 1066 is supported by AM2+ CPU for one
DIMM per channel only. Refer to www.asus.com for the supported CPU models.
DDR2-800 MHz capability
Size Vendor Part No. CL Chip Brand
SS/
DS
Chip No.
DIMM support
(Optional)
A* B* C*
512MB Kingston KVR1066D2N7/512 N/A Elpida SS E5108AJBG-1J-E • •
1G Kingston KHX8500D2/1G N/A Kingston DS Heat-Sink Package • •
1G Qimonda HYS64T128020EU-19F-C 6 Qimonda DS HYB18T512800CF19FFSS24313 • •
1G Kingmax KLED48F-A8K15 N/A Kingmax DS KKA8FFIXF-JFS-18A • •
1G Transcend TX1066QLJ-2GK1GB 5 Transced DS Heat-Sink Package • •
1G OCZ OCZ2N1066SR2DK N/A OCZ DS Heat-Sink Package • •
1G GEIL GE22GB1066C5DC 5 GEIL DS Heat-Sink Package • •
1G GEIL GE24GB1066C5QC 5 GEIL DS Heat-Sink Package • •
Size Vendor Part No. CL Chip Brand
SS/
DS
Chip No.
DIMM support
(Optional)
A* B* C*
1G Kingston KHX6400D2LL/1G N/A Kingston DS Heat-Sink Package • •
512MB Kingston KVR800D2N5/512 N/A Promos SS V59C1512804QCF25SY032406PECPA • •
2G Kingston KHX6400D2/2G N/A Kingston DS Heat-Sink Package • •
4G Kingston N/A N/A Elpida DS E2108ABSE-8G-E • •
512MB Samsung M378T6553GZS-CF7 6 Samsung SS K4T51083QG-HCF7 • •
2G Samsung M37875663QZ3-CF7 6 Samsung DS K4T1G084QQ-HCF7 • •
2G Samsung M391T5663QZ3-CF7 6 Samsung DS K4T1G084QQ-HCF7(ECC) • •
512MB Qimonda HYS64T64000EU-2.5-B2 6 Qimonda SS HYB18T512800B2F25FSS28380 • •
1G Micron MT9HTF12872AY-800E1 6 Micron SS D9HNP 7YE22(ECC) • •
1G Corsair XMS2-6400 4 Corsair DS Heat-Sink Package • •
512MB HY HYMP564U64CP8-S5 AB 5 Hynix SS HY5PS12821CFP-S5 • •
1G HY HYMP512U64CP8-S5 AB 5 Hynix DS HY5PS12821CFPS5 • •
512MB Kingmax KLDC28F-A8KI5 N/A Kingmax SS KKA8FF1XF-JFS-25A • •
1G Kingmax KLDD48F-A8K15 N/A Kingmax DS KKA8FFIXF-HFS-25A • •
512MB Apacer 78.91G91.9K5 5 Apacer SS AM4B5708JQJS8E0751C • •
2G Apacer 78.A1GA0.9K4 5 Apacer DS AM4B5808CQJS8E0740E • •
512MB Transcend TS128MLQ64V8J512MB N/A Micron SS 7HD22 D9GMH • •
1G Transcend 505485-1034 5 Transcend DS TQ123PJF8F0801 • •
512MB VDATA M2GVD6G3H3160Q1E52 N/A VDATA SS VD29608A8A-25EG20813 • •
1G ADATA M2OAD6G314170Q1E58 N/A ADATA DS AD29608A8A-25EG80810 • •
2G PSC AL8E8F73C-8E1 5 PSC DS A3R1GE3CFF734MAA0E • •
2G PSC AL7E8E63H-10E1K 5 PSC DS A3R1GE3CFF750RABBP(ECC) • •
1G GEIL GX22GB6400DC 5 GEIL DS Heat-Sink Package • •
2G GEIL GE28GB800C5QC 5 GEIL DS Heat-Sink Package • •
1G Super Talent T800UB1GC4 4 Super Talent DS Heat-Sink Package • •
1G G.SKILL F2-6400CL4D-2GBPK 4 G.SKILL DS Heat-Sink Package • •
2G G.SKILL F2-6400CL5D-4GBPQ 5 G.SKILL DS Heat-Sink Package • •
4G G.SKILL F2-6400CL5Q-16GNQ 5 G.SKILL DS Heat-Sink Package •
1G OCZ OCZ2VU8004GK 6 OCZ DS Heat-Sink Package • •
1G Elixir M2Y1G64TU8HB0B-25C 5 Elixir DS N2TU51280BE-25C802006Z1DV • •