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ASUS M5A99FX PRO R2.0
1-1
Chapter 1
Product introduction
1
1.1 Special features
1.1.1 Product highlights
AMD
®
FX™-Series/Phenom™ II/Athlon™ II/Sempron™ 100 Series Processors
(socket AM3+/AM3)
This motherboard supports AMD
®
AM3+/AM3 multi-core processors with unique L3 cache
and delivers better overclocking capabilities with less power consumption. It features dual-
channel DDR3 1866 memory support and accelerates data transfer rate up to 5200MT/s via
HyperTransport™ 3.0 based system bus. This motherboard also supports AMD
®
CPUs in the
new 32nm manufacturing process.
AMD
®
990FX Chipset
AMD
®
990FX Chipset is designed to support up to 5.2GT/s HyperTransport™ 3.0 (HT 3.0)
interface speed and dual PCI Express™ 2.0 x16 graphics. It is optimized with AMD
®
’s latest
AM3+ and multi-core CPUs to provide excellent system performance and overclocking
capabilities.
Dual-Channel DDR3 2133(O.C.)/ 1866/ 1600/ 1333/ 1066 MHz Support
The motherboard supports the dual-channel DDR3 memory that features data transfer rates
of DDR3 2133(O.C.)/ 1866/ 1600/ 1333/ 1066 MHz to boost the system’s performance,
and to meet the higher bandwidth requirements of 3D graphics, multimedia, and Internet
applications.
Quad-GPU SLI™ and Quad-GPU CrossFireX™ Support
The motherboard’s powerful AMD® 990FX platform optimizes PCIe allocation in multiple-
GPU congurations of either SLI™ or CrossFireX™. This allows you to enjoy a never before-
experienced brand new gaming style.
AMD® SB950 Chipset
The AMD
®
SB950 Southbridge natively supports the next generation SATA 6.0 Gb/s data
transfer rate and PCI Express 2.0 interface.
Complete USB 3.0 Integration
ASUS facilitates strategic USB 3.0 accessibility for both the front and rear panel – 4 USB
3.0 ports in total. Experience the latest plug & play connectivity at speeds up to 10 times
faster than USB 2.0. The M5A99FX PRO R2.0 affords greater convenience to high speed
connectivity.
Front Panel USB 3.0 Support
ASUS provides standardized USB 3.0 front panel support which is compatible with any
chassis. Enjoy faster throughput of USB 3.0 without relegating cables or hard-to-reach rear
I/O.