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5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
GND
DD[63:0]
MBRST[15:0]
P3P3V
VCC2
DMDSER
DCLK_L
LOADB_LZ
SACCLK
SACBUS
SCTRL_L
TRC_L
Title
Size Document Number Rev.
Date: Sheet
of
Project Code
Reviewed By Approved By
Prepared By
Model Name
PCB P/N
PCB Rev.
Benq Corporation
OEM/ODM Model Name
99.J8677.B12-C3-304-003
CHIP BOARD
13
ANGEL HU KELVIN LIAO
48.J8623.S01 S01
DAVID HN LIN
<Size>
PB610099.J8677.001
0
Wednesday, August 06, 2003
ODM
80*2_CONN
80*2_CONN
DD[63:0]
SACCLK
SACBUS
SCTRL_L
TRC_L
LOADB_LZ
DCLK_L
MBRST[15:0]
DMDSER
GND
VCC2
P3P3V
DMD_CHIP
DMD_CHIP
GND
DD[63:0]
MBRST[15:0]
P3P3V
VCC2
DMDSER
DCLK_L
LOADB_LZ
SACCLK
SACBUS
SCTRL_L
TRC_L