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CY7C1307BV25
CY7C1305BV25
Document #: 38-05630 Rev. *A Page 16 of 21
Maximum Ratings
(Above which the useful life may be impaired.)
Storage Temperature ................................ –65°C to + 150°C
Ambient Temperature with
Power Applied............................................–55°C to + 125°C
Supply Voltage on V
DD
Relative to GND....... –0.5V to + 3.6V
Supply Voltage on V
DDQ
Relative to GND .....–0.5V to + V
DD
DC Applied to Outputs in High-Z State –0.5V to V
DDQ
+ 0.5V
DC Input Voltage
[15]
...............................–0.5V to V
DD
+ 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current................................................... > 200 mA
Operating Range
Range
Ambient
Temperature (T
A)
V
DD
[16]
V
DDQ
[16]
Com’l 0°C to +70°C 2.5 ± 0.1V 1.4V to 1.9V
Ind’l –40°C to +85°C
Electrical Characteristics Over the Operating Range
[17]
DC Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ. Max. Unit
V
DD
Power Supply Voltage 2.4 2.5 2.6 V
V
DDQ
I/O Supply Voltage 1.4 1.5 1.9 V
V
OH
Output HIGH Voltage Note 18 V
DDQ
/2 – 0.12 V
DDQ
/2 + 0.12 V
V
OL
Output LOW Voltage Note 19 V
DDQ
/2
– 0.12 V
DDQ
/2 + 0.12 V
V
OH(LOW)
Output HIGH Voltage I
OH
= –0.1 mA, Nominal Impedance V
DDQ
– 0.2 V
DDQ
V
V
OL(LOW)
Output LOW Voltage I
OH
= 0.1 mA, Nominal Impedance V
SS
0.2 V
V
IH
Input HIGH Voltage
[15]
V
REF
+ 0.1 V
DDQ
+ 0.3 V
V
IL
Input LOW Voltage
[15, 20]
–0.3 V
REF
– 0.1 V
I
X
Input Load Current GND ≤ V
I
≤ V
DDQ
–5 5 µA
I
OZ
Output Leakage Current GND ≤ V
I
≤ V
DDQ,
Output Disabled –5 5 µA
V
REF
Input Reference Voltage
[21]
Typical value = 0.75V 0.68 0.75 0.95 V
I
DD
V
DD
Operating Supply V
DD
= Max., I
OUT
= 0 mA,
f = f
MAX
= 1/t
CYC
400 mA
I
SB1
Automatic
Power-Down
Current
Max. V
DD
, Both Ports
Deselected,V
IN
≤ V
IH
or V
IN
< V
IL
f = f
MAX
= 1/t
CYC,
Inputs Static
200 mA
AC Input Requirements Over the Operating Range
Parameter Description Test Conditions Min. Typ. Max. Unit
V
IH
Input HIGH Voltage V
REF
+ 0.2 – – V
V
IL
Input LOW Voltage – – V
REF
– 0.2 V
Thermal Resistance
[22]
Parameter Description Test Conditions
165 FBGA
Package Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test methods and proce-
dures for measuring thermal impedance, per
EIA/JESD51.
16.7 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
2.5 °C/W
Notes:
15.Overshoot: V
IH
(AC) < V
DDQ
+0.85V (Pulse width less than t
CYC
/2), Undershoot: VIL(AC) > –1.5V (Pulse width less than t
CYC
/2).
16.Power-up: Assumes a linear ramp from 0V to V
DD
(min.) within 200 ms. During this time V
IH
< V
DD
and V
DDQ
< V
DD
.
17.All Voltage referenced to Ground.
18.Output are impedance controlled. I
OH
= –(V
DDQ
/2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.
19.Output are impedance controlled. I
OL
= (V
DDQ/
2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.
20.This spec is for all inputs except C and C
Clock. For C and C Clock, V
IL
(Max.) = V
REF
– 0.2V.
21.V
REF
(Min.) = 0.68V or 0.46V
DDQ
, whichever is larger, V
REF
(Max.) = 0.95V or 0.54V
DDQ
, whichever is smaller.
22.Tested initially and after any design or process change that may affect these parameters.
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