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CY7C1380D, CY7C1382D
CY7C1380F, CY7C1382F
Document #: 38-05543 Rev. *F Page 20 of 34
Capacitance
[19]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package
Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V.
V
DDQ
= 2.5V
589pF
C
CLK
Clock Input Capacitance 5 8 9 pF
C
IO
Input/Output Capacitance 5 8 9 pF
Thermal Resistance
[19]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, in accordance with
EIA/JESD51.
28.66 23.8 20.7 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
4.08 6.2 4.0 °C/W
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