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CY7C64215
Document 38-08036 Rev. *C Page 27 of 30
Packaging Information
This section illustrates the package specification for the CY7C64215 enCoRe III, along with the thermal impedance for the package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Package Diagrams
Figure 9. 56-Pin (8x8 mm) QFN
001-12921**
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