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CY7C64215
Document 38-08036 Rev. *C Page 29 of 30
Ordering Information
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
Parameter Description Min Typical Max Unit
T
BAKETEMP
Bake Temperature 125 See package label °C
T
BAKETIME
Bake Time See package label 72 hours
Package Ordering Code Flash Size SRAM (Bytes)
56-Pin MLF CY7C64215-56LFXC 16K 1K
28-Pin SSOP CY7C64215-28PVXC 16K 1K
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