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Document Number: 38-12009 Rev. *F Page 34 of 36
Figure 22. 32-Pin (5x5 mm) MLF
Thermal Impedances Capacitance on Crystal Pins
51-85188 *B
Table 34. Thermal Impedances per Package
Package Typical θ
JA
*
8 PDIP 123 °C/W
8 SOIC 185 °C/W
20 PDIP 109 °C/W
20 SSOP 117 °C/W
20 SOIC 81 °C/W
32 MLF 22 °C/W
* T
J
= T
A
+ POWER x θ
JA
Table 35. Typical Package Capacitance on Crystal Pins
Package Package Capacitance
8 PDIP 2.8 pF
8 SOIC 2.0 pF
20 PDIP 3.0 pF
20 SSOP 2.6 pF
20 SOIC 2.5 pF
32 MLF 2.0 pF
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