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HCPL-3700 AC/DC to Logic Interface Optocoupler
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
HCPL-3700 Rev. 1.0.1 10
Carrier Tape Specifications
Reflow Profile
0.30 ±0.05
4.0 ±0.1
4.0 ±0.1
Ø1.55 ±0.05
Ø1.6 ±0.1
1.75 ±0.10
12.0 ±0.1
10.30 ±0.20
13.2 ±0.2
0.1 MAX
User Direction of Feed
4.90 ±0.20
16.0 ±
0
7.5 ±0.1
10.30 ±0.20
• Peak reflow temperature: 225 C (package surface temperature)
• Time of temperature higher than 183 C for 60–150 seconds
• One time soldering reflow is recommended
215 C, 10–30 s
225 C peak
Time (Minute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Temperature (°C)
Time above 183 C, 60–150 sec
Ramp up = 3
C/sec