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HCPL-3700 AC/DC to Logic Interface Optocoupler
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
HCPL-3700 Rev. 1.0.1 8
Package Dimensions
Through Hole
Surface Mount
Note:
All dimensions are in inches (millimeters)
0.4" Lead Spacing
Recommended Pad Layout for Surface Mount
Leadforms
0.200 (5.08)
0.140 (3.55)
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0.020 (0.51) MIN
0.390 (9.91)
0.370 (9.40)
0.270 (6.86)
0.250 (6.35)
3
0.070 (1.78)
0.045 (1.14)
241
567
8
0.300 (7.62)
TYP
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
15° MAX
PIN 1
ID.
SEATING PLANE
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
0.370 (9.40)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.405 (10.30)
MIN
0.315 (8.00)
MIN
0.045 [1.14]
3214
567
8
0.016 (0.41)
0.008 (0.20)
PIN 1
ID.
0.200 (5.08)
0.140 (3.55)
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0.004 (0.10) MIN
0.390 (9.91)
0.370 (9.40)
0.270 (6.86)
0.250 (6.35)
3
0.070 (1.78)
0.045 (1.14)
241
567
8
0.400 (10.16)
TYP
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
0° to 15°
PIN 1
ID.
SEATING PLANE
0.070 (1.78)
0.060 (1.52)
0.030 (0.76)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)