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Removal and replacement procedures
Maintenance and Service Guide 4–45
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Step 3 applies to HP Pavilion computer models. See Step 2 for HP Mini and Compaq Mini Computer models.
3. Remove the heat sink assembly 2.
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The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time
the fan and heat sink are removed:
■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■ Thermal pads are used on the Intel GS45 (8W) chip 3 and the heat sink section 4 that services it.
■ Thermal pads are used on the Southbridge ICH9M chip 5 and the heat sink section 6 that services it.
Replacement thermal material is included with all system board and heat sink assembly spare part kits.
Reverse this procedure to install heat sink.