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Removal and replacement procedures
Maintenance and Service Guide 4–53
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
each time the fan and heat sink are removed:
■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
■ Thermal pads are used on the graphics subsystem memory module 5 and the heat sink section 6 that
services it.
Replacement thermal material is included with all system board, heat sink, and processor spare part kits.
5. If it is necessary to replace the fan:
a. Remove the four Phillips PM2.0×4.0 screws 1 that secure the fan to the heat sink.
b. Remove the heat sink 2 by lifting it straight up.
Reverse this procedure to install the fan and heat sink.