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LAN interconnect module uplink ports
The LAN interconnect module uplink ports are typically used to connect the interconnect switches to
the network infrastructure; however, they are standard Ethernet switch ports and may be used as
desired. The GbE2 interconnect kits are identical with exception of the LAN interconnect modules. The
C-GbE2 Interconnect kit includes two QuadT2 interconnect modules, each with four 10/100/1000T
Ethernet ports with RJ-45 connectors. The F-GbE2 Interconnect Kit includes two QuadSX interconnect
modules, each with four 1000SX Ethernet ports with LC connectors. Each interconnect module has an
independent guide pin to ensure insertion alignment and a robust connector assembly to prevent it
from being used with incompatible devices.
Table 1. Interconnect modules used with the C-GbE2 and F-GbE2 Interconnect Kits
Components C-GbE2 Interconnect Kit F-GbE2 Interconnect Kit
Interconnect switches Two GbE2 Interconnect Switches Two GbE2 Interconnect Switches
Interconnect modules Two QuadT2 interconnect modules with:
• Four 10/100/1000 BASE-T/TX/T ports
• Four RJ-45 connectors with link speed
and activity LEDs.
Two QuadSX interconnect modules with:
• Four 1000 BASE-SX ports
• Four LC connectors with link speed
and activity LEDs
Front panel ports
Two 10/100/1000T external ports are conveniently located on the front panel. These front panel
ports allow users to perform local management and diagnostic tasks without unplugging a dedicated
uplink. This prevents disruption the production network to perform these tasks. See the “Serviceability
and diagnostics” section for more details on the switch front panel.
When the front panel ports are not used for local management, one or both ports may be used as
additional uplinks. A channel is provided at bottom of each interconnect switch to allow network
cables to be routed from the front to the rear of the rack, or vice versa.
10-Gb fabric
The GbE2 Interconnect Switch offers maximum flexibility and investment protection supporting
enterprise networking requirements today and in the future. Each GbE2 Interconnect Switch includes a
10-Gb (10,000 Mb/s) internal fabric. This fabric is based on the Broadcom HiGig™ technology for
sophisticated chip-to-chip interconnection enabling intelligent packet switching at 20 Gb/s data
bandwidth full duplex.
The 10-Gb fabric supports future planned upgrades including:
• A layer 7 option that provides network routing and IP load balancing content delivery switching.
The 10-Gb fabric for each switch includes an internal card slot that supports an optional layer 7
mezzanine card (Figure 3).
• A 10-Gb Ethernet uplink upgrade, which is ideal for bandwidth-intensive applications and
convergence of IP-based network and storage systems. Users can add a 10-Gb Ethernet switch
mezzanine card to each GbE2 interconnect switch via a second option card slot in the 10-Gb
fabric (Figure 3). The existing Gb LAN interconnect modules are replaced with new interconnect