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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the heat sink is removed. Replacement
thermal material is included with the base enclosure, heat sink, processor, and system board
spare part kits.
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that
services it
●
A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
NOTE: Steps 5 through 7 apply to computer models equipped with an Intel processor. See
steps 2 through 4 for heat sink removal information for computer models equipped
with an AMD processor.
5. Disconnect the fan cable (1) from the system board.
Component replacement procedures 81