Filter
Top Products
Packaging TechnologyPackaging TechnologyPackaging Technology
R
10 Intel
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
Figure 2-3. Intel
®
6700PXH 64-bit PCI Hub Package Dimensions (Bottom View)
0.200 C
4X
15.500
1.270
23X
(0.895)
8X 14.605
23X 1.270
2
3
4
5
6
7
8
9
10
11
12
13
14
29.2100
31.000 + 0.100
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
4X
0.635
31.000 + 0.100
+
+
15
16
17
18
19
20
21
22
23
24
A
B
A
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
2.1 Package Mechanical Requirements
The PXH package has an exposed bare die, which is capable of sustaining a maximum static normal
load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load
applied to any edge of the bare die. These mechanical load limits must not be exceeded during
heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use
condition.
Notes
1. The heatsink attach solutions must not include continuous stress onto the chipset package with
the exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the
bare die/IHS top surface.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only.