R
Intel
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 3
Contents
1 Introduction.....................................................................................................................7
1.1 Definition of Terms...............................................................................................7
1.2 Reference Documents .........................................................................................8
2 Packaging Technology...................................................................................................9
2.1 Package Mechanical Requirements...................................................................10
3 Thermal Specifications.................................................................................................11
3.1 Thermal Design Power (TDP) ............................................................................11
3.2 Die Case Temperature Specifications................................................................11
4 Thermal Simulation ......................................................................................................13
5 Thermal Metrology........................................................................................................15
5.1 Die Case Temperature Measurements...............................................................15
5.1.1 Zero Degree Angle Attach Methodology................................................15
6 Reference Thermal Solution ........................................................................................17
6.1 Operating Environment ......................................................................................17
6.2 Heatsink Performance........................................................................................17
6.3 Mechanical Design Envelope.............................................................................18
6.4 Board-Level Components Keepout Dimensions.................................................18
6.5 Torsional Clip Heatsink Thermal Solution Assembly ..........................................18
6.5.1 Heatsink Orientation..............................................................................20
6.5.2 Extruded Heatsink Profiles ....................................................................20
6.5.3 Mechanical Interface Material................................................................20
6.5.4 Thermal Interface Material.....................................................................21
6.5.5 Heatsink Clip.........................................................................................21
6.5.6 Clip Retention Anchors..........................................................................22
6.6 Reliability Guidelines..........................................................................................22
A Thermal Solution Component Suppliers.....................................................................23
A.1 Torsional Clip Heatsink Thermal Solution...........................................................23
B Mechanical Drawings ...................................................................................................25