Filter
Top Products
Introduction
R
8 Intel
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
T
case_max
Maximum die temperature allowed. This temperature is measured at the geometric center
of the top of the package die.
T
case_min
Minimum die temperature allowed. This temperature is measured at the geometric center
of the top of the package die.
TDP Thermal design power. Thermal solutions should be designed to dissipate this target
power level. TDP is not the maximum power that the chipset can dissipate.
1.2 Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
• Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
(ICH5R) Datasheet
• Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide
• Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide
• Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet
• Intel® 6700PXH 64-bit PCI Hub (PXH) Specification Update
• Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
• Intel® 6300ESB I/O Controller Hub Datasheet
• Intel® 6300ESB I/O Controller Hub (ICH) Specification Update
• BGA/OLGA Assembly Development Guide
• Various system thermal design suggestions (http://www.formfactors.org)
Note: Unless otherwise specified, these documents are available through your Intel field sales
representative. Some documents may not be available at this time.