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Philips Semiconductors Product specification
TOPFET high side switch BUK215-50Y
SMD version of BUK210-50Y
MECHANICAL DATA
Fig.34. SOT426 surface mounting package
1
, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOT426
0 2.5 5 mm
scale
Plastic single-ended surface mounted package (Philips version of D
2
-PAK); 5 leads
(one lead cropped)
SOT426
e e ee
E
b
A
1
A
A
1
L
p
bc
D
max.
e
A
UNIT
DIMENSIONS (mm are the original dimensions)
E
11
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
2.90
2.10
H
D
15.80
14.80
Q
2.60
2.20
10.30
9.70
D
1
1.60
1.20
1.70
98-12-14
99-06-25
1
3
24 5
mounting
base
D
1
H
D
D
Q
L
p
c
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
May 2001 12 Rev 1.010