Filter
Top Products
( 4 / 40 )
Contents
Chapter 1. Precautions for Safety ...........................................................................................7
1.1 Safety Symbols and Meanings ..............................................................................8
Warning for Installation ...................................................................................9
Warning for Use Environment.........................................................................9
Caution to Be Taken for Modifying This Product ...........................................9
Cautions to Be Taken for This Product ...........................................................9
Notes on Target System .................................................................................10
Note on Reset Input from the Target System ................................................10
Notes on Stack Area ......................................................................................10
Note on MCU Files ........................................................................................10
Notes on EMEM Dialog ................................................................................11
Note on Boot Mode........................................................................................11
Note on Breaks Used with Internal Resources ..............................................11
Note on Debug Monitor Area ........................................................................11
Note on Interface with the Target System .....................................................12
Notes on Service-Life of the MCU's Internal Flash ROM ............................12
Note on Debug Commands during STP/WIT Instruction .............................12
Notes on Disabling Watchdog Function ........................................................12
Note on Real-Time RAM Monitor ................................................................12
Note on Coverage Measurement....................................................................12
Note on Differences between Actual MCU and Emulator ............................13
Chapter 2. Preparation ..........................................................................................................15
2.1 Terminology ........................................................................................................16
2.2 Package Components ..........................................................................................17
2.3 Other Tool Products Required for Development ................................................17
2.4 System Configuration..........................................................................................18
Chapter 3. Setting Up ...........................................................................................................19
3.1 Switch Settings ....................................................................................................20
3.2 A-D Conversion Bypass Capacitor .....................................................................21
3.3 Connecting the Emulation Pod Main Unit ..........................................................22
3.4 Connecting the Target System ............................................................................24